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The D.Module2.C6657 is based on the Texas Instruments Keystone dual-core processor TMS320C6657. The Keystone multicore DSPs are characterized by huge computational power and fast serial interfaces. In the D.Module2 family it can be used independently or in conjunction with vertically stacking data acquisition and FPGA modules.
Key Features
TMS320C6657 dual-core DSP
Gbit Ethernet, PCIe
512 Mbytes RAM
high throughput parallel and serial peripheral interfaces
I2C, SPI, UART, USB, and GPIO
stand-alone operation
Applications
The D.Module2.C6657 is perfectly suitable for radar applications, nondestructive material inspection, machine vision and software defined radio (SDR). An optional FPGA for data preprocessing is easily interfaced through Serial Rapid IO (SRIO), PCI express (PCIe) or via the fast Universal Parallel Port (uPP). Gigabit Ethernet enables network integration for control, remote maintenance and data streaming.
Specifications
DSP
TMS320C6657
dual-core 1.25 GHz fixed- and floating-point, up to 40 GMAC / 20 GFLOP per core
Memory
DSP-internal
32K bytes data cache, 32K bytes program cache per core, 1M byte direct mapped or level-2 cache per core, 1M byte shared RAM
*) EMIF and UPP are exclusive modes and cannot be used simultaneously
Real-Time Clock
1
provision for external buffer power supply
System Supervisor
watchdog, voltage and temperature, optional fan control and tacho supervisor
Emulation Interface
JTAG
I/O Level
LVTTL / LVCMOS
all signals except ETH, PCIe and SRIO: high level min. 2V, max. 3.5V, low level min. -0.2V, max. 0.8V, output drive: external bus interface:± 12 mA, all others ± 4 mA
Power Supply
3.3V
single supply, 2A typ., 3A peak
Firmware
D.Module2.BIOS
bootloader, board initialization, board configuration, flash memory programming, UART and USB I/O
Setup Utility
program and data file uploads to the flash memory via USB or UART
Config File
user- configurable text file with program and initialization parameters
Temperature Range
0 – 55°C, 0 – 70°C with forced cooling
Connectors
BUS1, BUS2, COM, EXP
Molex 71436-2164
PCIe / SRIO
Molex 46556-1145
JTAG
14-pin, 2.54mm pitch
Mechanics
86.8 x 58.4 mm, overall height including heatsink: 33mm
ROHS
compliant
Ordering Information
D.Module2.C6657
standard module
D.Module2.C6657i
Industrial temperature range module -40..+85°C (forced cooling) -40..+65°C (heatsink)
DS.TCPIP-DM6657
Ethernet Development Support Package for D.Module2.C6657
DK.C6657
C6657 development kit including D.Module2.C6657, XDS200 JTAG in-circuit emulator, D2.Base.P base board, power supply, RS232 and USB cable, support software, and user’s guide.
DK.C6657-FMC
C6657 and FPGA development kit including D.Module2.C6657, D.Module2.6SLX45T, XDS200 JTAG in-circuit emulator, D2.Base-FMC base board, power supply, USB cable, DSP support software, FPGA interface examples in VHDL, and user’s guides.
Peripheral Daughter Cards
D.Module2.6SLX45T
D.Module2.ADDA500K16
D.Module.ADDA16 (with D2.Base + SON.DM2-DM)
D.Module.AD7722 (with D2.Base + SON.DM2-DM)
D.Module.PCM3003 (with D2.Base + SON.DM2-DM)
Development Tools
Emulators
XDS200
XDS220
XDS220ISO
XDS560V2 System Trace
XDS560V2 LC Traveler
XDS560V2 STM Traveler
Compiler
Code Composer Studio
Prototyping Boards
D2.Base.I
D2.Base.P
D2.Base-FMC (with D.Module2.6SLX45T)
TCP/IP Stack
DS.TCPIP-DM6747
D.Module2.C6657 Datasheet
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