Differential Scanning Calorimeter DSC Tg, Tm, Tc, ΔH, Cp, Degree ...

Trang chủ » Tm Tc Tg » Differential Scanning Calorimeter DSC Tg, Tm, Tc, ΔH, Cp, Degree ...

Có thể bạn quan tâm

Search for: Search for: iST-Integrated Service Technology iST-Integrated Service Technology Skip to content
  • Services
    • Verification Analysis
    • FIB Circuit Edit
    • Engineering Sample Preparation
    • Failure Analysis
    • Signal Integrity
    • Material Analysis
    • Reliability Test
    • Chemical Analysis
    • Various Consultancy
    • Others
    • Hardware Solutions
    • MOSFET Wafer Backend Process (BGBM)
  • Tech Library
  • About iST
    • Brand Story
    • Professional Accreditations
    • Awards & Honors
    • Partnerships
    • Contact Us
  • Press Room
    • Press Releases
    • Media Report
  • Investors
    • Financials
    • Corporate Governance
    • Shareholder Services
  • Careers
    • Choose iST
    • Join iST
    • Come to iST
    • FAQ | Contact HR
  • ESG
  • Contact Us
    • Office Locations
    • Contact Windows
  • Language
    • 繁體中文
    • 简体中文
    • English
    • 日本語
  • Search
DSC

The Differential Scanning Calorimeter (DSC) detects changes in temperature and heat flow during thermal transitions of material by placing sample material in a furnace programmed with rising, declining, or constant temperatures and purged with constant ambient gas (e.g. nitrogen).

Understanding Specs and Analysis Tools of Crucial Thermal Characteristics of Advanced Packaging Materials

  • What iST can do for you?

    You may get important material characteristics by analyzing their heat flow-temperature variation curves.

    • Glass Transition Temperature, Tg
    • Melting Point, Tm
    • Crystallization Temperature, Tc
    • Reaction Heat, ΔH
    • Specific Heat Capacity, Cp
    • Degree of Cure

Case Sharing

  • Glass Transition Temperature (Tg)
  • Melting Point (Tm)
  • Melting Point (Tm) & Crystallization Temperature (Tc)
  • Reaction Heat, ΔH
DSC_Glass Transition Temperature, Tg
DSC_Melting Point, Tm
DSC_Melting Point (Tm) & Crystallization Temperature, Tc
DSC_Reaction Heat, ΔH
  • Application of DSC
  • Equipment Capacity
  • Applied Industry
  • Material Property Verification and Comparison
  • Process Quality Control
  • Reaction Heat and Calculation of the Extent of Reaction
  • Analysis over Rubber Curing Degree
TA Q20
  • Maximum Temperature Range: -90℃~550℃
  • Temperature Accuracy: ±0.05℃
  • Sensitivity: 1.0μW
  • Heat Measurement Accuracy: ±0.1%
  • PCB Industry
  • Photoelectric Industry
  • Chemicals and Chemical Engineering Industry
  • Material R&D

Contact Window | Mr. Chiang/Neal | Tel:+886-3-5799909#6176 | Email:[email protected]

Other services you may be interested in
  • Thermomechanical Analyzer (TMA)
  • Thermogravimetric Analyzer (TGA)
  • Dynamic Mechanical Analyzer (DMA)

Verification Analysis

FIB Circuit Edit FIB Introduction and Application
  • FIB Circuit Edit/ CAD Probe Pad Debug
  • The Innovative FIB Circuit Edit (N-FIB)
  • G2 WLCSP circuit edit solution
Engineering Sample Preparation Quick Assembly
  • Wafer Dicing Saw
  • Die Bonding
  • IC Wire Bonding / Assembly
Surface Mount Technique (SMT)
  • Surface Mount Technique (SMT)
Failure Analysis Electrical Characteristics Measurement
  • I-V Curve Measurement
  • Auto Curve Tracer (ACT)
  • Nano Prober
  • Probe Measurement
  • TLP measurement of ESD Protection Devices
Non-Destructive Analysis
  • 3D OM
  • SAT
  • X-ray Inspection (2D X-ray)
  • High Resolution 3D X-ray Microscope
  • Scanning Acoustic Tomography (SAT)
Sample Preparation
  • IC Decapsulation
  • IC Delayer
  • Cross-section & Backside polish
  • Ion Beam Cross-section Polisher (CP)
Defect Detection
  • Emission Microscope (EMMI)
  • InGaAs EMMI
  • Optical Beam Induced Resistance Change (OBIRCH)
  • Thermal EMMI (InSb)
Competitive Analysis
  • IC structure/ Competitive Analysis
Signal Integrity Signal Integrity Test
  • HDMI Test / Debug / Certification
  • HDCP Test ／Debug／Certification
  • Display Port Test／Debug／Certification
  • VESA DisplayHDR / DisplayHDR True Black Pre-test / Debug / Certification
  • Special Cable Signal Test
  • USB-IF Compliance Test / Debug / Certification
  • VESA AdaptiveSync Display Test / Debug / Certification
  • VESA ClearMR Test / Debug / Certification
  • USB-IF EU Conformity Test / Debug / Certification
Design Quality Management (DQM)
  • Compatibility Test
  • Software Maturity Test
AI High-Speed Signal Solution
  • PCB Substrate Characteristic Test
  • PHY Conformance
  • High-Speed Signal Test Fixture
  • SI/PI Simulation & Design Evaluation
Others
  • International Market Access Service
Material Analysis Sample Preparation
  • Dual Beam FIB
Structure Observation
  • Scanning Electron Microscope (SEM)
  • Dual Beam FIB
  • Plasma FIB
  • Transmission Electron Microscopy(TEM)
Surface Analysis
  • Auger Electron Spectroscopy (AES)
  • XPS/ESCA
  • Secondary Ion Mass Spectrometer (SIMS)
  • X-ray diffraction (XRD)
  • Atomic Force Microscopy (AFM)
  • White light interferometry (WLI)
  • Fourier Transform Infrared Spectroscopy (FTIR)
Thermal Analysis
  • Dynamic Mechanical Analyzer (DMA)
  • Differential Scanning Calorimeter (DSC)
  • Thermogravimetric Analyzer (TGA)
  • Thermomechanical Analyzer (TMA)
Component Analysis
  • Scanning Electron Microscope (SEM)
  • Auger Electron Spectroscopy (AES)
  • XPS/ESCA
  • Transmission Electron Microscopy(TEM)
  • Electron Energy Loss Spectroscopy (EELS)
Crystallographic Analysis
  • Electron Backscatter Diffraction (EBSD)
  • X-ray diffraction (XRD)
Reliability Test Component Reliability Test Accelerated Environmental Stress Test
  • MSL Test
  • Temperature Humidity Test
Accelerated Lifetime Simulation Test
  • Non-volatile Memory Reliability
  • Operating Life Test (OLT)
  • High Temperature Operating Life Test(HTOL)
Package Assembly Integrity Test
  • Wire Bonding Integrity
  • Solder Ball Integrity
  • Package Lead Integrity Test
  • Package Assembly Integrity Test
Electrical Verification Test
  • ESD/ EOS / Latch-up Verification
  • Low Voltage Surge Test
  • EMC Verification (EMI+EMS)
  • Conductive Atomic Force Microscopy (C-AFM)
  • Mechanical stress test
Board Level Reliability Test Low Strain Rate Test
  • Thermal Cycling / Shock Test
  • Monotonic Bending / Cyclic Bending Test
High Strain Rate Test
  • Mechanical Shock Test
  • Vibration Test
  • Steady-State Test
  • Mechanical Stress tests
  • BLR Integrated Failure Analysis
PCB Design Verification
  • PCB Design and Fabrication Service
  • PCB Reliability Test
  • Load Board
  • Probe Cards
  • Pressure Conductive Silicone Rubber (PCR)
SMT Services
  • Surface Mount Technique (SMT)
Automotive Electronics Test
  • BLR Verification for Automotive Electronics
  • Automotive System/PCB Reliability Test
  • Reliability Test of Automotive IC (AEC-Q)
Warpage Verification
  • Warpage Measurement
  • Surface 3D Profiler
Others
  • Accelerated Corrosion Verification Platform
  • PCB Pad Cratering Verification
  • Trace weight measurement and analysis
  • Packaged Devices Weight Loss/Gain Analysis
Chemical Analysis Consultancy for green and environmental protection regulations
  • Environmental Regulation Test
  • Chemical Substance Management
Precise and quantitative analysis and unknown substance analysis
  • Verification of PCB/ PCBA Chemicals
  • Oil/ Water/ Soil/ Gaseous pollutant Analysis
  • Micro Pollution (Unknown Material) Test/ Analysis
  • Reliability Test of Automotive IC (AEC-Q)
Various Consultancy Quality assurance and function safety consultancy
  • Total Quality Management Consultancy (IATF 16949)
  • ISO 26262 Consultancy
ESG consultancy
  • Value-Added Services for HSE and ESG
  • Greenhouse Gas/Carbon and Water Footprint Assessment /ISO 50001 Consultancy
Laboratory accreditation and Green Mark consultancy
  • ISO/IEC 17025 Lab Certification Consultancy
  • WEEE Environment Protection Logo and EPEAT Consultancy

Others

Hardware Solutions Design And Fabrication
  • Rubber Socket (PCR)
  • Load Board
  • Probe Card
  • Reliability Module and Monitoring System
  • Burn-in Board
  • MLO (Multilayer Organic Substrate)
  • IC Engineering Substrate
Simulation Services
  • SI/PI Simulation & Design Evaluation
MOSFET Wafer Backend Process (BGBM) MOSFET Front-Side Metallization Process
  • Chemical / Electro-less Plating
  • Front-Side Metal Sputtering Deposition
MOSFET Backside Grinding Process
  • Wafer Thinning / Non-Taiko Grinding/Conventional Grinding (BGBM)
MOSFET Backside Metallization Process
  • Metal Evaporation Deposition for Backside Metallization
  • Thick Ag Process

Come to iST

Global location

Từ khóa » Tm Tc Tg