Fa Xing Che - Dblp
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showing all ?? records- 2016
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, Xiaowu Zhang
, Jong-Kai Lin: Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis. Microelectron. Reliab. 61: 64-70 (2016)- 2012
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, Suhana Binti Mohd Said
, Mohd Faizul Mohd Sabri
, Irfan Anjum Badruddin
, Fa Xing Che
: Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products. Microelectron. Reliab. 52(11): 2701-2708 (2012)- 2011
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, Toshitsugu Ueda: Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending. Microelectron. Reliab. 51(9-11): 1850-1855 (2011)
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- conf/3dic/ChePHTGG11

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, Wahyuaji Narottama Putra
, A. Heryanto, A. Trigg, S. Gao, Chee Lip Gan: Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV). 3DIC 2011: 1-6
Irfan Anjum Badruddin[j2] 2
Chee Lip Gan[c1] 3
S. Gao[c1] 4
A. Heryanto[c1] 5
Jong-Kai Lin[j3] 6
Wahyuaji Narottama Putra[c1] 7
Mohd Faizul Mohd Sabri[j2] 8
Suhana Binti Mohd Said[j2] 9
Hongbin Shi[j1] 10
Dhafer Abdulameer Shnawah[j2] 11
A. Trigg[c1] 12
Toshitsugu Ueda[j1] 13
Xiaowu Zhang[j3] 
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