Mold Electronics For Automotive Applications - IOPscience

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Paper • The following article is Open accessIn-depth scrutinization of In- Mold Electronics for Automotive applications

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Published under licence by IOP Publishing Ltd Journal of Physics: Conference Series, Volume 1969, International Virtual Conference on Intelligent Robotics, Mechatronics and Automation Systems 2021 (IRMAS 2021), 26-27 March 2021, Chennai, IndiaCitation KP Srinivasan and T Muthuramalingam 2021 J. Phys.: Conf. Ser. 1969 012064DOI 10.1088/1742-6596/1969/1/012064

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KP Srinivasan

AFFILIATIONS

Department of Mechatronics Engineering, SRM Institute of Science and Technology, Kattankulathur-603203, India

EMAIL

[email protected]

T Muthuramalingam

AFFILIATIONS

Department of Mechatronics Engineering, SRM Institute of Science and Technology, Kattankulathur-603203, India

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Open scienceAuthors

KP Srinivasan

AFFILIATIONS

Department of Mechatronics Engineering, SRM Institute of Science and Technology, Kattankulathur-603203, India

EMAIL

[email protected]

T Muthuramalingam

AFFILIATIONS

Department of Mechatronics Engineering, SRM Institute of Science and Technology, Kattankulathur-603203, India

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