PHI 660 Scanning Auger Microprobe System - MEMS Exchange

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MNXPHI 660 Scanning Auger Microprobe System

PHI 660 Scanning Auger Microprobe System
Model 660
Type commercial
Equipment Characteristics
MOS clean no
Piece dimensionRange of wafer piece dimensions the equipment can accept 1 .. 25 mm
Piece geometryGeometry of wafer pieces the equipment can accept circular, irregular, other, rectangular, triangular shard
Piece thicknessRange of wafer piece thickness the equipment can accept 100 .. 1000 µm
Wafer diameter(s)List or range of wafer diameters the tool can accept 25 mm
Wafer geometryTypes of wafers this equipment can accept 1-flat, 2-flat, no-flat, notched
Wafer materialsList of wafer materials this tool can accept (not list of all materials, just the wafer itself). BK7, Borofloat (Schott), ceramic, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, Pyrex (Corning 7740), quartz (fused silica), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator
Wafer thicknessList or range of wafer thicknesses the tool can accept 100 .. 1000 µm
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