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Copper clad laminates (CCL)

KB – 6150 (A, B, C)

• Excellent dimensional stability
• Excellent heat resistance and mechanical properties
• CTI value 150 V / 175 V / 300 V / 600 V

KB – 6160 (A, B, C)

• Excellent heat resistance and mechanical properties
• UV Blocking and AOI (automated optical inspection) compatible – increasing productivity and accuracy
• CTI value 150 V / 175 V / 300 V / 600 V

KB – 6164 (6164 F)

• TG 140ᵒ C (DSC Testing)
• UV Blocking and AOI (automated optical inspection) compatible – increasing productivity and accuracy
• Excellent heat resistance

KB – 6165 (6165 F, 6165 GC)

• Anti-CAF
• High thermal decomposition temperature (Td)
• Excellent heat resistance and appropriate for lead-free assembly
• Dicy-free and no filler resin system

KB – 6167 (6167 F)

• TG 170ᵒ C (DSC Testing), low Z-axis expansion
• UV Blocking and AOI (automated optical inspection) compatible – increasing productivity and accuracy
• High Thermal Delamination
• Excellent heat resistance and appropriate for lead-free assembly

KB HF – 140

• Halogen-free, eliminated all kinds of brominated flame-retardants, the bromine and the chlorine are smaller than 0.09 % each, total content is lower than 0.15 %.
• Antimony-free, absence of highly-toxic dioxins in burning exhaust gas
• PCB processing and other properties similar to normal FR- 4

KB- 150 / 1150 / 150 D

• Low-cost but with wide range of applications
• Warpage and twist are small and stable
• Suitable for punching at 40 – 70ᵒ C
• Excellent thickness uniformity

KB FR 1

• KB-3151C / 3151S / 3151HS / 3152 C / 3153
• In high temperature warpage and twist both less than 1.0 %
• High CTI Value (CTI over 600 V need special request)
• Suitable for punching at 40-70ᵒ C
• Superior electric properties under moisture condition
• Suitable for double-side application by silver through hole
• Less odor
• Halogen-free – environmental-friendly

KB FR 2

• KB –2150G / 2150GC
• Less odor
• Halogen-free – environmental-friendly
• High CTI over 600 V
• Superior heat and humidity resistance
• Suitable for punching at 40-70ᵒ C
• Warpage and twist are small and stable

H140 A - H140A

• Tg 135 ± 5ᵒ C (DSC) – Different Tg available upon request – Tg 140 ± 5ᵒ C, Tg ≥ 140ᵒ C
• UV Blocking AOI (automated optical inspection) compatible, so as to increase productivity efficiency
• UV Blocking and natural color CCL upon request
• No UV Blocking and natural color CCL upon request

APPLICATIONS

• Mobile phone
• Computer
• Communication equipment
• Instrumentation
• VCR, Television,
• Electronic game machine, etc. 

H155 A

• Tg 150 ± 5ᵒ C (DSC)
• UV Blocking AOI (automated optical inspection) compatible, so as to increase productivity efficiency
• UV Blocking and natural color CCL upon request
• No UV Blocking and natural color CCL upon request
• APPLICATIONS
  • Mobile phone
  • Computer
  • Communication equipment
  • Instrumentation
  • VCR, Television,
  • Electronic game machine, etc.

Copper clad laminates (CCL) – Halogen free

FR4 H1600A high CTI – H1600A

• Tg 135 ± 5ᵒ C (DSC)
• CTI ≥600 / Excelent tracking resistance,
• UV Blocking AOI (automated optical inspection) compatible,
• Good PCB processability
• APPLICATIONS
  • Power base board,
  • TV
  • Refrigerators
  • Washing machines

H140 HF - H140H

• Halogen-free product, Tg: 135± 5ᵒ C
• UL94V-0 / Flammability UL 94V-0
• High CTI Halogen free product aveliable upon request (CTI 600)
• APPLICATIONS
  • Mobile phone
  • Communication equipment
  • Instrumentation
  • VCR, Television, etc.

H155 H - H155H

• Halogen-free product, Tg: 150± 5ᵒ C
• UL94V-0 / Flammability UL 94V-0
• High CTI Halogen free product aveliable upon request (CTI 600)
• APPLICATIONS
  • Mobile phon
  • Communication equipment
  • Instrumentation
  • VCR, Television, etc.

Composite Epoxy Material (CEM)

KB CEM 1 - KB-5150 (&)

• Excellent punching property, the best punching temperature 45 – 70ᵒ C
• Excellent heat and moisture resistance as well as CTI value
• IPC-4101B specification is applicable

KB CEM 3 - KB-7150 (C)

• Excellent mechanical process ability and applicable punching process
• Electrical properties and PCB processing are similar to FR-4, the wearing of drill bit is much lower than that of FR4.
• CTI value 175 V / 300 V / 600 V

HA30 – Thermal conductive CEM 3 - HA30

• Excellent thermal conductivity, ≥1.0 W /m∙K
• Excellent solder heat endurance, Lead-free compatible CEM 3 laminate
• White and opaque with good color-change resistance
• Excellent mechanical processability
• APPLICATIONS
  • LED backlight module
  • Consumer lightning
  • Automotive electronics
  • Power supplies

Aluminium base copper-clad (ALU)

HA50 – Aluminium substrate CCL- HA50

• Excellent thermal conductivity
• Excellent breakdown voltage
• RoHS compliance
• Excellent mechanical propetries
• Excellent electromagnetic shielding
• Can use external cooling device directly
• High cost performance
• APPLICATIONS
  • LED lightning, Backlight module, outdoor LED display
  • Consumer lightning
  • Automotive electronics (Vehicle lightning, regulator, converters, power module)
  • Digital, PC, Audio
  • The area needs high heat dissipation

Prepreg

PREPREG - KB-6060X series

Kingboard prepregs are E-glass fabrics impregnated with flame retardant epoxy resin and cured to »B« stage under precise temperature and metering control to achive consistent theology in the multilayer printed circuit board production.

• Excellent interlayer bonding strength with optimum flow
• Consistent dielectric thickness and electrical characteristics
• Wide processing tolerance and consistent performance

Copper foil

Kingboard Copper Foil Ltd is one of the largest copper foil manufacturers in China. Their product range includes rough and gelatinized copper foil for use in laminates and printed circuit boards, with thickness ranging from 8 – 105 µm. They are also continuously developing new kinds of copper foil products, including battery copper foils, extremely low peak value copper foils, 2-side processing copper foil and high temperature and high-extensibility copper foils.

KB Copper Foils:

“STD” Standard Uncoated Copper Foil – STD copper foil Usage: Suitable for both internal and external parts of copper foil in multi-layer wiring board (FR-4). Characteristics: High tensile and ductile competence, good bonding strength, heat resistance and corrosion resistance.

“HTE” Uncoated Copper Foil – HTE copper foil Usage: Suitable for the internal part of copper foil for multi-layer wiring board (FR-4). Characteristics: High heat tensile and ductile competence, good bonding strength, heat resistance, corrosion resistance, anti-oxidization.

“LP” Uncoated Copper Foil – LP copper foil Usage: Suitable for the internal part of copper foil for multi-layer wiring board (FR-4). Characteristics: High heat tensile and ductile competence, good bonding strength, heat resistance, corrosion resistance, anti-oxidization.

Coated Copper Foil – Coated copper foil Usage: Suitable for FR-1 paper laminate board. “CTI” adhesive-coated copper foil is suitable for high voltage resistance board. Characteristics: High heat tensile and ductile competence, heat resistance. CTI Copper Foil is of high voltage resistance.

Battery Copper Foil – Battery copper foil (BC) Usage: Suitable for negative electrode of lithium cell. Characteristics: High heat tensile and ductile competence, heat resistance.

Entry and back boards (E&B)

KL - SAFETY DATA SHEET - DRILLING BOARDS KL - SAFETY DATA SHEET- ALU ENTRY board KL - SAFETY DATA SHEET- BACK UP BOARD KL - TECHNICAL DATA - MPH50-MELAMINE PAPER DRILLBOARD KL - TECHNICAL DATA - PH - PAPER PHENOLIC BROWN DRILLBOARD KL - TECHNICAL DATA-MW-BACK UP BOARD KL - W-BACK UP W20 AND W25 KL-SAFETY DATA SHEET