Ryzen 3 3200G - AMD - WikiChip

Edit Values
Ryzen 3 3200G
General Info
DesignerAMD
ManufacturerGlobalFoundries
Model Number3200G
Part NumberYD3200C5M4MFH, YD3200C5FHBOX
MarketDesktop
IntroductionJune 12, 2019 (announced)July 7, 2019 (launched)
Release Price$ 99
ShopAmazon
General Specs
FamilyRyzen 3
Series3000
Frequency3,600 MHz
Turbo Frequency4,000 MHz
Bus typePCIe 3.0
Clock multiplier36
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureZen+
Core NamePicasso
Process12 nm
Transistors4,940,000,000
TechnologyCMOS
Die209.78 mm²
Word Size64 bit
Cores4
Threads4
Max Memory64 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
TDP65 W
cTDP down45 W
OP Temperature0° C – 95 °C
Packaging
PackageOPGA-1331
Package TypeOrganic Micro Pin Grid Array
Dimension40 mm × 40 mm
Pitch1 mm
Contacts1331
SocketSocket AM4

Ryzen 3 3200G is a 64-bit quad-core entry-level performance x86 desktop microprocessor introduced by AMD in mid 2019. This processor is based on AMD's Zen+ microarchitecture and is fabricated on a 12 nm process. The 3200G operates at a base frequency of 3.6 GHz with a TDP of 65 W and a Boost frequency of 4 GHz. This APU supports up to 64 GiB of dual-channel DDR4-2933 memory and incorporates Radeon Vega 8 Graphics operating at up to 1.25 GHz.

This model supports a configurable TDP-down of 45 W.

Contents

  • 1 Cache
  • 2 Memory controller
  • 3 Expansions
  • 4 Graphics
  • 5 Features
  • 6 Die

Cache[edit]

Main article: Zen+ § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.Note: All units are in kibibytes and mebibytes.
L1$384 KiB393,216 B 0.375 MiB
L1I$256 KiB262,144 B 0.25 MiB 4x64 KiB4-way set associative 
L1D$128 KiB131,072 B 0.125 MiB 4x32 KiB8-way set associativewrite-back
L2$2 MiB2,048 KiB 2,097,152 B 0.00195 GiB
  4x512 KiB8-way set associativewrite-back
L3$4 MiB4,096 KiB 4,194,304 B 0.00391 GiB
  1x4 MiB  

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg Integrated Memory Controller
Max TypeDDR4-3200
Supports ECCNo
Max Mem64 GiB
Controllers2
Channels2
Max Bandwidth43.71 GiB/s44,759.04 MiB/s 46.933 GB/s 46,933.255 MB/s 0.0427 TiB/s 0.0469 TB/s
Bandwidth Single 21.86 GiB/sDouble 43.71 GiB/s

Expansions[edit]

The 3200G includes 20 PCIe lanes - 16 for a discrete graphics processor and 4 for storage (NVMe or 2 ports SATA Express).

[Edit/Modify Expansions Info]

ide icon.svg Expansion Options
PCIe
Revision3.0
Max Lanes20
Configs1x16+1x4
USB
Revision3.0, 2.0
Ports4
Rate5 Gbit/s
SATA
Revision3.0
Ports4

Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg Integrated Graphics Information
GPURadeon Vega 8
DesignerAMD
Execution Units8Max Displays3
Unified Shaders512
Burst Frequency1,250 MHz1.25 GHz 1,250,000 KHz
OutputDP, HDMI
Standards
DirectX12
OpenGL4.6
OpenCL2.2
[Edit] Zen with Radeon Vega Hardware Accelerated Video Capabilities
Codec Encode Decode
Max FPS @1080p @1440p @2160p @1080p 4:2:0 @2160p 4:2:0
MPEG-2 (H.262)   60 FPS N/A
VC-1
VP9 8bpc 240 FPS 60 FPS
VP9 10bpc
MPEG-4 AVC (H.264) 8bpc 120 FPS 60 FPS 30 FPS
MPEG-4 AVC (H.264) 10bpc  
HEVC (H.265) 8bpc 120 FPS 60 FPS 30 FPS
HEVC (H.265) 10bpc  
JPEG/MJPEG 8bpc

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
SSE4aStreaming SIMD Extensions 4a
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
SHASHA Extensions
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
SMTSimultaneous Multithreading
AMD-ViAMD-Vi (I/O MMU virtualization)
AMD-VAMD Virtualization
SenseMISenseMI Technology

Die[edit]

Further information: Zen+ § Die
  • 12 nm process
  • 4,940,000,000 transistors
  • 209.78 mm² die size
raven ridge die.png raven ridge die (annotated).png

Từ khóa » Chip R3 3200g