APAMA C2W - Advanced Packaging (TCB) - Kulicke & Soffa

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English 简体中文 日本語 eServices Login Your browser does not support the video tag. Your browser does not support the video tag. Your browser does not support the video tag. Your browser does not support the video tag. Your browser does not support the video tag. Advanced Solutions (TCB)

APAMA C2W

Brochure
• APAMA™ Series - November 2020 Request Download

Chip-to-WAFER (C2W)

The APAMA Chip-to-Wafer (C2W) offers fully Automated solution for Thermo-Compression Bonding (TCB), High Density Fan-Out Wafer Level Packaging (HD FOWLP) and High Accuracy Flip Chip (HA FC). Cost-of-Ownership Advantage Modular designs allow the flexibility of upgrading from HD FOWLP or HA FC to TCB processes enabling effective cost-of-ownership and preserving the investments of our customers. C2W Features & Benefits:

• Automation
• Control
• Placement Accuracy
• Performance
• Yield Enhancement
• Adaptability
• Cost-of-Ownership Advantage

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• HBM Memory Stacking
• Network Routers and Switches
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• Smartphones and Tablets

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Equipment
• Advanced Dispensing Solutions
• Advanced Solutions (Flip-Chip)
• Advanced Solutions (TCB)
• Ball Bonder
• Wafer Level Bonder
• Wedge Bonder

Consumables
• Capillaries
• Dicing Blades
• Wedge Bond Consumables

Support Services
• K&S Care
• Repair, Refurbishment and Spares Program

Software
• Auto Offline Programming
• KNeXt
• MES/NPI

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