Impact Of N2O/NH3/N2 Gas Mixture On The Interface Quality Of ...
© 2016 ECS - The Electrochemical Society ECS Transactions, Volume 75, Number 8Citation Ghada Dushaq et al 2016 ECS Trans. 75 661DOI 10.1149/07508.0661ecst
AuthorsGhada Dushaq
AFFILIATIONS
Masdar Institute for Science and Technology
Mahmoud Rasras
AFFILIATIONS
Masdar Institute of Science and Technology
Ammar Nayfeh
AFFILIATIONS
Masdar Institue of Science and Technology, Abu Dhabi, UAE
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Open scienceAuthorsGhada Dushaq
AFFILIATIONS
Masdar Institute for Science and Technology
Mahmoud Rasras
AFFILIATIONS
Masdar Institute of Science and Technology
Ammar Nayfeh
AFFILIATIONS
Masdar Institue of Science and Technology, Abu Dhabi, UAE
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Article information 1938-5862/75/8/661Abstract
In this paper, nitration of germanium surface using a mixture of N2O, NH3 and N2 is performed using RF-PECVD reactor. The electrical characteristics of Al/HfO2/GeON/p-Ge capacitors are investigated. Results show that the hysteresis of metal–oxide–semiconductor (MOS) capacitors with nitration-based passivation step is reduced to ~150 mV, compared with ~400mV of the untreated sample. The suppression of hysteresis is attributed to the reduction of electron traps and enhancement of dielectric/Ge interface quality. The improved interface quality of plasma-based nitration of Ge surface is a promising technique for high performance Ge MOSFET fabrication.
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